Band identifier system for wearable devices

ABSTRACT

Wearable electronic devices, such as smart watches, can be provided with a band for securing the device to a wearer. The device and the band can include near-field communications (NFC) components that allow the device to uniquely identify the band. Device operations such as the color, theme, or content displayed on the device can be based, in part, on the identification of a particular band. The band may include a miniature NFC tag in an attachment portion of the band that is configured to be received in a recess in a housing of the device. An NFC module for reading the NFC tag can be provided within the recess of the housing, so that the attachment portion of the band and the recess in the device housing position and align the NFC tag with the NFC module when the band is attached to the device.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/200,660, entitled “Band Identifier System For Wearable Devices,”filed on Mar. 12, 2021, which claims the benefit of priority to U.S.Provisional Patent Application No. 62/992,076, entitled “Band IdentifierSystem For Wearable Devices,” filed on Mar. 19, 2020 and U.S.Provisional Patent Application No. 62/989,527, entitled “Identificationof Watch Bands,” filed on Mar. 13, 2020, the disclosure of each of whichis hereby incorporated herein in its entirety.

TECHNICAL FIELD

The present description relates generally to wearable devices, and, moreparticularly, to band identifier systems for wearable devices.

BACKGROUND

A variety of wearable electronic devices, including smart watches, havebeen developed that include components to provide a variety offunctions. For example, some wearable electronic devices include one ormore sensors to measure various characteristics of the user and/or theenvironment in which the device operates. Such devices may include adisplay to indicate the time, date, or other device features. Thedevices may also include accelerometers and one or more sensors thatenable a user to track fitness activities and health-relatedcharacteristics, such as heart rate, blood pressure, and bodytemperature, among other information. The devices also typically includea rechargeable battery that powers the electronics within the device,and a mechanical strap or band for securing the device to a user.

BRIEF DESCRIPTION OF THE DRAWINGS

Certain features of the subject technology are set forth in the appendedclaims. However, for purpose of explanation, several embodiments of thesubject technology are set forth in the following figures.

FIG. 1 illustrates a perspective view of a wearable electronic deviceimplemented as a watch on a wrist of a user, in accordance with aspectsof the disclosure.

FIG. 2 illustrates a cross-sectional side view of a wearable electronicdevice, in accordance with aspects of the disclosure.

FIG. 3 illustrates a top view of a wearable electronic device system, inaccordance with aspects of the disclosure.

FIG. 4 illustrates a cross-sectional side view of a portion of awearable electronic device, in accordance with aspects of thedisclosure.

FIG. 5 illustrates a perspective view of a portion of a band for awearable electronic device, in accordance with aspects of thedisclosure.

FIG. 6 illustrates a side perspective view of a portion of a housing ofa wearable electronic device, in accordance with aspects of thedisclosure.

FIG. 7 illustrates a cross-sectional side view of a portion of awearable electronic device with a band secured to the housing of thedevice, in accordance with aspects of the disclosure.

FIG. 8 illustrates a partially exploded perspective view of a near-fieldcommunications component for a housing of a wearable electronic device,in accordance with aspects of the disclosure.

FIG. 9 illustrates a partially exploded perspective view of anothernear-field communications component for a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 10 illustrates an assembled top perspective view of an antennamodule of the near-field communications component of FIG. 9 , inaccordance with aspects of the disclosure.

FIG. 11 illustrates an assembled bottom perspective view of the antennamodule of the near-field communications component of FIG. 9 , inaccordance with aspects of the disclosure.

FIG. 12 illustrates a cross-sectional view of the near-fieldcommunications component of FIG. 9 installed in a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 13 illustrates another cross-sectional view of the near-fieldcommunications component of FIG. 9 installed in a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 14 illustrates an exploded perspective view of a near-fieldcommunications module for a band, in accordance with aspects of thedisclosure.

FIG. 15 illustrates perspective views of antenna elements that can beimplemented in an antenna assembly, in accordance with aspects of thedisclosure.

FIG. 16 illustrates a partially exploded top perspective view of anothernear-field communications module for a band, in accordance with aspectsof the disclosure.

FIG. 17 illustrates a partially exploded bottom perspective view of thenear-field communications module of FIG. 16 , in accordance with aspectsof the disclosure.

FIG. 18 illustrates a cross-sectional view of a band for a wearableelectronic device with the near-field communications component of FIG.16 , in accordance with aspects of the disclosure.

FIG. 19 illustrates a cross-sectional side view of the antenna assemblyof FIG. 16 , in accordance with aspects of the disclosure.

FIG. 20 illustrates a cross-sectional end view of the antenna assemblyof FIG. 16 and the antenna assembly of FIGS. 9-13 , in accordance withaspects of the disclosure.

FIG. 21 illustrates a cross-sectional view of a near-fieldcommunications module disposed in a rigid band material, in accordancewith aspects of the disclosure.

FIG. 22 illustrates a cross-sectional view of a near-fieldcommunications module disposed in a flexible band material, inaccordance with aspects of the disclosure.

FIG. 23 illustrates a side view of an antenna module for a near-fieldcommunications module for a band, in accordance with aspects of thedisclosure.

FIG. 24 illustrates a side view of a multi-coil antenna module for anear-field communications module for a band, in accordance with aspectsof the disclosure.

FIG. 25 illustrates a top view of the multi-coil antenna module of FIG.24 , in accordance with aspects of the disclosure.

FIG. 26 illustrates a partially exploded perspective view of anothernear-field communications component for a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 27 illustrates an exploded perspective view of the near-fieldcommunications component of FIG. 26 , in accordance with aspects of thedisclosure.

FIG. 28 illustrates an assembled bottom perspective view of the antennamodule of the near-field communications component of FIG. 26 , inaccordance with aspects of the disclosure.

FIG. 29 illustrates an assembled top perspective view of anothernear-field communications component for a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 30 illustrates an assembled top perspective view of a multi-coilnear-field communications component for a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 31 illustrates a cross-sectional view of a cap for a near-fieldcommunications component installed in a housing of a wearable electronicdevice, in accordance with aspects of the disclosure.

FIG. 32 illustrates a perspective top view of a cap for a near-fieldcommunications component for installation in a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 33 illustrates a cross-sectional view of the cap of FIG. 32installed in a housing of a wearable electronic device, in accordancewith aspects of the disclosure.

FIG. 34 illustrates a cross-sectional view of another cap for anear-field communications component installed in a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 35 illustrates a perspective top view of the cap of FIG. 34 , inaccordance with aspects of the disclosure.

FIG. 36 illustrates a cross-sectional view of another cap for anear-field communications device installed in a housing of a wearableelectronic device, in accordance with aspects of the disclosure.

FIG. 37 illustrates a cross-sectional view of a co-finished cap for anear-field communications device integrally formed with a housing of awearable electronic device, in accordance with aspects of thedisclosure.

FIG. 38 illustrates a cross-sectional view of another co-finished capfor a near-field communications device integrally formed with a housingof a wearable electronic device, in accordance with aspects of thedisclosure.

DETAILED DESCRIPTION

The detailed description set forth below is intended as a description ofvarious configurations of the subject technology and is not intended torepresent the only configurations in which the subject technology may bepracticed. The appended drawings are incorporated herein and constitutea part of the detailed description. The detailed description includesspecific details for the purpose of providing a thorough understandingof the subject technology. However, it will be clear and apparent tothose skilled in the art that the subject technology is not limited tothe specific details set forth herein and may be practiced without thesespecific details. In some instances, well-known structures andcomponents are shown in block diagram form in order to avoid obscuringthe concepts of the subject technology.

Wearable electronic devices such as smart watches can include a mainbody formed in part by a device housing in which components such assensors, processing circuitry, memory, a battery, and/or other hardwareare enclosed. The main body may include a display mounted to the housingsuch that the housing and the display form an enclosure for thecomponents. The display can be controlled to display a home screen suchas a watch face (e.g., including an indicator of time, an indicator ofthe date, an activity indicator, or any other information), and/or userinterfaces for one or more applications that can be executed on thedevice. The home screen and/or user interfaces can be displayed with atheme or a color palette selected by the user or generated automaticallyby the device.

To secure a wearable electronic device to the body of a user, one ormore straps or bands can be coupled to the housing of the main body. Thestraps or bands can be removable and/or replaceable. Users can replacethe straps or bands for various reasons. As examples, a user may removea band of one color to replace the band with a band of another color(e.g., to match the user's outfit or mood), or may replace a band of onetype with a band of another type (e.g., to replace a fashion band wornduring the workday with sport band for a workout). However, because thehome screen and user interfaces displayed on the display of the wearableelectronic device are also customized and/or thematic, the new band mayclash or otherwise be contradictory or incompatible with the contentdisplayed by the device.

The systems and methods disclosed herein provide a band identificationsystem for a wearable electronic device that allows a wearableelectronic device to uniquely identify a band that is coupled to a mainbody of the device. The systems and methods disclosed herein may includenear-field communications components that allow a wearable electronicdevice to uniquely identify and/or obtain other information from a bandthat is coupled to a main body of the device without requiring a powersource to be provided in the band. The systems and methods disclosedherein allow a wearable electronic device to uniquely identify and/orobtain other information from a band that is coupled to a main body ofthe device while maintaining the structural integrity of a housing ofthe device, including preventing ingress of moisture or fluid tointernal cavities of the device.

Upon identification of a particular band using the near-fieldcommunications components of the band identification system, one or morecomponents and/or features of the wearable electronic device can bemodified to correspond to the identified band. For example, the colorpalette or theme of displayed content can be changed, without userinput, to match one or more colors of an identified band. In anotherexample, upon identification of a fitness band, a fitness application ora fitness related home screen can be displayed by the wearableelectronic device. In another example, upon identification of or removalof a swim band, water protection features such as water purging featuresof the device can be activated.

The band identification systems and methods described herein may alsofacilitate identification of authorized and/or unauthorized bands for awearable electronic device. For example, third party bands may beunauthorized bands that are advertised for use with a particularwearable electronic device, but may not properly secure to the device,which can cause a risk of damage to the device. Upon determination thata band that is coupled to the device is not an authorized band, awarning may be provided using an output component of the device, and/orone or more features of the device may be disabled or otherwisemodified. In another example, a particular band may be associated with aparticular application or service on the wearable electronic device.Upon identification of a band that is associated with a particularapplication or service on the wearable electronic device, the device mayactivate or provide access to features associated with that applicationor service.

The systems and methods disclosed herein may also facilitateidentification by a wearable electronic device of one or morecharacteristics of a band. The characteristics of the band may includethe color, shape, or style of the band and/or a capability of the band.For example, in some implementations, a band may include one or moreband components that provide various capabilities for the band. Bandcomponents may include, as examples, one or more sensors (e.g.,environmental sensors, biometric sensors, gesture sensors, inertialsensors, or the like), processing circuitry, additional communicationscircuitry, input components, audio and/or haptic output components, abattery, and/or one or more display components. The systems and methodsdisclosed herein may include near-field communications components thatenable a wearable electronic device to identify, access, power, and/orutilize the band components (e.g., to add additional capability for thewearable electronic device).

These and other features of the disclosed systems and methods arediscussed below with reference to FIGS. 1-21 . However, those skilled inthe art will readily appreciate that the detailed description givenherein with respect to these Figures is for explanatory purposes onlyand should not be construed as limiting.

FIG. 1 depicts a perspective view of a wearable electronic device thatis secured to a body of a user. In the example of FIG. 1 , a wearableelectronic device 100 is implemented as a smart watch that is attachedby a band 108 to a wrist 102 of a user. However, it should beappreciated that wearable electronic device 100 can be implementeddifferently from the example shown in FIG. 1 . For example, a smartphone, a gaming device, a digital music player, a sports accessorydevice, a medical device, a navigation assistant, an accessibilitydevice, a device that provides time and/or weather information, a healthassistant, and/or other types of electronic devices can be secured tovarious parts of a body of a user by a band 108. Band 108 may be formedfrom one or more materials such as fabric, metal, plastic, rubber,and/or a combination of these or other materials.

As shown in FIG. 1 , wearable electronic device 100 includes a housing104 and a display 106. Housing 104 can form an outer surface or partialouter surface and protective case for one or more internal components ofwearable electronic device 100. In the example of FIG. 1 , housing 104is formed into a substantially rectangular shape, although thisconfiguration is not required and other shapes are possible in otherimplementations.

In some examples, the display 106 may incorporate an input deviceconfigured to receive user input. The display 106 can be implementedwith any suitable technology, including, but not limited to, amulti-touch sensing touchscreen that uses liquid crystal display (LCD)technology, light emitting diode (LED) technology, organiclight-emitting display (OLED) technology, organic electroluminescence(OEL) technology, or another type of display technology. Display 106 mayinclude a transparent rigid outer layer that forms a portion of theouter surface of wearable electronic device 100. The transparent rigidouter layer may, for example, be a protective cover glass formed from arigid and scratch resistant material such as ion-implanted glass,laminated glass, or sapphire. Display 106 may be mounted to housing 104such that display 106 and housing 104 combine to form a main body 101 ofwearable electronic device 100 and to form an enclosure in which theinternal components of wearable electronic device 100 are housed.

FIG. 2 illustrates a cross-sectional view of a portion of wearableelectronic device 100 at which band 108 is coupled to housing 104. Asshown in FIG. 2 , internal components of wearable electronic device 100,such as processing circuitry 200 (e.g., a printed circuit board and/orone or more integrated circuits) and a battery 202 can be housed withinan enclosure formed by housing 104 and display 106. The enclosure mayform a water-resistant or water-proof cavity 201 for the internalcomponents that allow wearable electronic device 100 to be wornunderwater (e.g., to a depth of 10 meters, 20 meters, 50 meters, 100meters, 150 meters, or 200 meters) without allowing fluid or moistureingress into cavity 201.

FIG. 2 also shows how housing 104 may include a recess 204 that isshaped and sized to receive an attachment portion 206 of band 108.Attachment portion 206 of band 108 may be secured within recess 204 by afriction fit and/or by one or more engagement members of housing 104and/or band 108. Attachment portion 206 may be integrally formed withthe rest of band 108 (e.g., and formed from a common material) orattachment portion 206 may be formed from a different material from therest of the band 108 (e.g., and permanently secured to the rest of band108 or coupled to the rest of band 108 at an adjustable interface, suchas by looping through an opening in attachment portion 206).

As shown in FIG. 2 , a near-field communications (NFC) module 210 (alsoreferred to herein as a near-field communications component) can bemounted to housing 104 at a location near or within recess 204. Band 108may include a corresponding NFC module 208. When attachment portion 206of band 108 is secured within recess 204, recess 204 and attachmentportion 206 of band 108 may position NFC module 210 of main body 101 inalignment with NFC module 208 in band 108 and within a distance 214 thatallows NFC module 210 to read a tag of NFC module 208 to obtain a uniqueidentifier for band 108 and/or other information (e.g., identifiers ofone or more characteristics and/or capabilities) for band 108. Forexample, power may be provided to NFC module 210 (e.g., from processingcircuitry 200 such as via a connector such as a flexible printed circuit212, a wire bond, or any other suitable connector) to allow an antennaelement of NFC module 210 to wirelessly activate a corresponding antennaelement of NFC module 208 to transmit a unique identifier of band 108and/or other information for band 108 to processing circuitry 200 viaNFC module 210. Upon identification of band 108, processing circuitry200 may modify the operation of display 106 and/or other componentsand/or features of wearable electronic device 100 based on theparticular band that is identified. Although various examples aredescribed herein in which NFC module 208 and NFC module 210 cooperate totransmit an identifier of a band 108 to wearable electronic device 100,it should be appreciated that NFC module 208 can store and/or transmitother information for band 108 (e.g., one or more characteristics ofband 108 such as one or more capabilities of band 108 that areassociated with one or more (optional) band components 231 of band 108)to wearable electronic device 100, and/or that NFC module 210 can beoperated to provide power and/or control signals to one or morecomponents of band 108.

In the example of FIG. 2 , a wearable device system is shown thatincludes a main body 101 that includes a device housing 104, processingcircuitry 200 disposed within the device housing 104, a recess 204 on anedge of the device housing 104, and a first near-field communicationsmodule 210 mounted within the device housing 104 adjacent to the recess204. The wearable device system shown in FIG. 2 also includes aremovable band 108 that is configured to secure the main body 101 to awearer, the removable band including an attachment portion 206configured to be received in the recess 204 in the device housing 104 toremoveably attach the removable band 108 to the main body 101, and asecond near-field communications module 208 at least partially embeddedwithin the attachment portion 206. FIG. 2 illustrates an attachedconfiguration for the removable band 108, in which the attachmentportion 206 of the removable band 108 and the recess 204 in the devicehousing 104 are configured to align the first near-field communicationsmodule 210 with the second near-field communications module 208. Forexample, the attachment portion 206 of the removable band 108 and therecess 204 in the device housing 104 may be configured to position afirst antenna of the first near-field communications module 210 at apredetermined distance of less than one millimeter from a second antennaof the second near-field communications module 208.

FIG. 3 illustrates a top view of a wearable device system with wearableelectronic device 100 in a configuration in which two bands 108-1 and108-2 are positioned for attachment to housing 104 of main body 101.Band 108-1 and 108-2 may each extend to a free end (not explicitlyshown) configured to wrap around the wrist (or other body portion) ofthe user and attach to the free end of other of band 108-1 and 108-2 tosecure wearable electronic device 100 to the user.

As shown, band 108-1 and 108-2 may be arranged to be received incorresponding recesses 204-1 and 204-2 on opposing sides of housing 104.In the example of FIG. 2 , band 108-1 includes an NFC module 208-1configured for alignment with a first NFC module 210-1 in recess 204-1,and band 108-2 includes an NFC module 208-2 configured for alignmentwith a second NFC module 210-2 in recess 204-2. NFC modules 208-1 and208-2 may include a common tag that uniquely identifies the pair ofbands 108-1 and 108-2, or NFC modules 208-1 and 208-2 may each include atag that uniquely identifies the band 108-1 or 108-2 in which that NFCmodule is disposed. For example, if NFC modules 208-1 and 208-2 eachinclude a tag that uniquely identifies the band 108-1 or 108-2 in whichthat NFC module is disposed, a user of wearable electronic device 100can mix and match different pairs of bands and wearable electronicdevice 100 can respond accordingly. For example, if wearable electronicdevice 100 identifies band 108-1 as a yellow band and band 108-2 as agreen band, processing circuitry 200 can modify the theme of a displayedwatch face to include a yellow-to-green color gradient across thedisplay in the direction from band 108-1 to 108-2.

Although both bands 108-1 and 108-2 are provided with a correspondingNFC element in FIG. 3 , it should be appreciated that, in someimplementations, a single NFC module can be provided in a single band toidentify that band or a pair of bands. Although an arrangement with twobands 108-1 and 108-2 that attach to each other at free ends thereof isshown in FIG. 3 , it should be appreciated that, in someimplementations, a single continuous (e.g., stretchable band that canexpand and/or contract to fit on a user's wrist) can be coupled to mainbody 101 and identified with a single NFC module 208.

In the example of FIG. 3 , each of band 108-1 and 108-2 includesadditional features. Band 108-1 of FIG. 3 includes a bumper 300-1 and anengagement member 302-1. Band 108-2 of FIG. 3 includes a bumper 300-2and an engagement member 302-2. Bumpers 300-1 and 300-2 may be passivemembers embedded or partially embedded in bands 108-1 and 108-2respectively, that facilitate movement of bands 108-1 and 108-2,respectively, into and/or out of recesses 204-1 and 204-2. For example,in configurations in which bands 108-1 and 108-2 are formed from a softor flexible material (e.g., rubber), bumpers 300-1 and 300-2 may berigid (e.g., plastic or metal) bumpers that help bands 108-1 and 108-2slide within recesses 204-1 and 204-2. As another example, inconfigurations in which bands 108-1 and 108-2 are formed from a rigidmaterial (e.g., metal), bumpers 300-1 and 300-2 may be soft or flexible(e.g., rubber) bumpers that help prevent bands 108-1 and 108-2 fromslipping too easily within recesses 204-1 and 204-2. Engagement members302-1 and 302-2 may be actuable members that can be extended to securebands 108-1 and 108-2 in recesses 204-1 and 204-2 or retracted to allowbands 108-1 and 108-2 to slide out of recesses 204-1 and 204-2.

In various implementations, NFC modules 208-1 and 208-2 of band 108-1and 108-2 include outer surfaces formed from substantially the samematerial as bumpers 300-1 and 300-2 and act as additional bumpers forbands 108-1 and 108-2 in addition to providing NFC identification ofbands 108-1 and 108-2.

FIG. 4 illustrates a cross-sectional side view of a portion of main body101, with the cross-section being taken through recess 204 and NFCmodule 210 in one implementation. In the example of FIG. 4 , recess 204has a curved surface 400, and NFC module 210 includes an interfaceportion 404 with an outer surface 402 that forms a portion of thesurface 400 of recess 204. In the example of FIG. 4 , outer surface 402is substantially flush with the portions of surface 400 that are formedby housing 104. However, in other implementations, outer surface 402 maybe recessed from surface 400, or may extend partially into recess 204from surface 400 to press against an outer surface of NFC module 208when a band 108 is installed in recess 204.

As can be seen in FIG. 4 , NFC module 210 can be arranged in housing 104so as to form a barrier between the environment external to main body101 and a cavity 201 (e.g., a water-proof or water-resistant cavity)within main body 101. For this reason, interface portion 404 can bearranged to withstand a predetermined amount of pressure (e.g., one bar,two bar, three bar, five bar, at least five bar, or more than five bar)to provide the desired water resistance for wearable electronic device100. For example, interface portion 404 can extend laterally beyond thefootprint of NFC module 210 to rest against a ledge 406 on housing 104within an opening 407 in the recess 204. In this arrangement, when waterpressure from within recess 204 presses against surface 402, interfaceportion 404 is pressed against ledge 406 to resist the pressure.

In the example of FIG. 4 , a cowling 419 can be seen that can provideadditional support for NFC module 210 (e.g., by attachment of thecowling 419 to housing 104 such as by a screw or other attachmentmember). Cowling 419 may be arranged to provide a neutral force supportfor NFC module 210 (e.g., relative to recess 204) that does not applypressure to NFC module 210 that could overcome an adhesive or otherattachment mechanism between ledge 406 and interface portion 404, butthat provides additional resistance to pressure such as water pressureon surface 402. In the example of FIG. 4 , a connector implemented as aflexible printed circuit 212 communicatively couples NFC module 210 withprocessing circuitry 200 in cavity 201.

FIG. 5 illustrates a perspective view of a portion of a band 108 inwhich a recess 500 is provided in the band NFC module 208. As shown, NFCmodule 208 can be installed in band 108 along with one or more passiveband elements such as a bumper 300, and an engagement member 302. Bumper300 may be formed from a material that is similar to, or the same as thematerial of a module housing for NFC module 208, so that bumper 300(e.g., a passive bumper that is free of computing circuitry) and NFCmodule 208 (e.g., an active bumper that provides mechanical bumperfunctionality in addition to NFC tag functionality) provide surfacesthat facilitate installation and/or removal of band 108 from recess 204in housing 104. Engagement member 302 may be, for example, aspring-loaded or other resiliently compressible member that can snapinto a corresponding notch within recess 204 to secure band 108 withinthe recess.

For example, FIG. 6 illustrates an implementation of housing 104 inwhich a notch 600 is provided in recess 204 into which engagement member302 of FIG. 5 can extend, when band 108 located within recess 204 suchthat engagement member 302 is aligned with notch 600. In such aconfiguration in which band 108 has been extended into recess 204 suchthat engagement member 302 is aligned and engaged with notch 600, NFCmodule 208 in band 108 will also have been positioned in alignment withand opposed to NFC module 210 in recess 204. In this way, NFC module 210and NFC module 208 are positioned (e.g., with aligned antennas separatedby a predetermined distance) such that NFC module 210 can generate a NFCsignal that inductively causes NFC module 208 in band 108 to transmit aunique identifier for band 108 back to NFC module 210.

In the example of FIG. 6 , recess 204 has a length that extends along anedge of housing 104 (e.g., the device housing of wearable electronicdevice 100) and is open at opposing ends 607 of the length. In thisconfiguration, recess 204 is configured to receive the attachmentportion 206 of removable band 108 from an end (e.g., one of ends 607) ofthe recess, along the length of the recess. NFC module 208 may form anactive bumper for band 108, the active bumper configured to slide alongsurface 400 of recess 204 as attachment portion 206 is received from theend of the recess along the length of the recess.

FIG. 7 shows a cross-sectional view of a portion of device 100, thecross-section taken along line A-A of FIG. 6 , in an attachedconfiguration in which attachment portion 206 of the band 108 of FIG. 5has been installed in recess 204 of housing 104 (e.g., by slidingattachment portion 206 of band 108 into recess 204 along a directionparallel to the elongate dimension of recess 204). As shown in FIG. 7 ,attachment portion of band 108 is formed from a material 729. Material729 may include, for example, a rubber, a flouroelastomer, leather, afabric such as a woven nylon, a metal, or any combination of these orother materials. As shown in FIG. 7 , attachment portion 206 may have anouter surface 700 with a shape that corresponds to the shape of surface400 of recess 204.

In the example of FIG. 7 , NFC module 208 includes a band module housing702 that is attached within recess 500 in band material 729 by anadhesive 708. An antenna 720 and a memory chip 706 are disposed withinthe band module housing 702 such that antenna 720 of NFC module 208 isaligned with a corresponding antenna 721 of NFC module 210. As shown inFIG. 7 , when band 108 of is installed in recess 204 of housing 104, anouter surface of band module housing 702 may be in contact with outersurface 402 of NFC module 210. In this configuration, antenna 720 ispositioned in alignment with and sufficiently close to antenna 721 ofNFC module 210 to be able transmit a unique identifier that is stored inmemory 706 to NFC module 210 (e.g., when antenna 720 is powered viainductive coupling to antenna 721 of NFC module 210). Band modulehousing 702 may be formed from a material that is opaque to visiblelight and transparent to electromagnetic fields generated by antenna 720and a corresponding antenna 721 in NFC module 210. Band module housing702 may be formed from a material having a color that matches the colorof one more passive bumpers in band 108 such as bumper 704 of FIG. 7and/or bumper 300 of FIG. 3 .

In the example of FIG. 7 , band 108 includes a support structure 701embedded within band material 729. Support structure 701 may providerigid support for attachment portion 206 of band 108. As shown, supportstructure 701 may include two opposing recesses, corresponding to twoopposing recesses in band material 729, within which NFC module 208 andan opposing bumper 704 (e.g., similar to bumper 300 of FIG. 3 , but onan opposing side of band 108 from NFC module 208) can be positioned. Asshown, when band 108 is installed in recess 204 of housing 104, an outersurface of bumper 704 may be in contact with a portion of the surface400 of recess 204.

Additional details of NFC module 210 can also be seen in FIG. 7 . Forexample, in the implementation illustrated in FIG. 7 , NFC module 210includes antenna 721 coupled to interface portion 404, which isimplemented as a cap that is secured by adhesive 722 (e.g., athermosetting polymer such as epoxy) to housing 104 (e.g., to ledge 406and/or other portions of the opening 407 in recess 204). In the variousimplementations of NFC module 210 described herein, the cap (interfaceportion 404) may be formed, for example, from a material that is opaqueto visible light and transparent to electromagnetic fields generated byantenna 721 and antenna 720 in NFC module 208. Band module housing 702and/or the cap (interface portion 404) of NFC module 210 may be formedfrom a material that is electrically insulating so that thecommunicative coupling between band 108 and device 100 is an inductive(NFC) coupling without any direct conductive contact between NFC module208 and NFC module 210.

Adhesive 733 is provided to attached an antenna assembly for antenna 721to interface portion 404. A stiffener layer such as a glass-reinforcedepoxy laminate layer is disposed on an opposing side of flexible printedcircuit 212 to the side on which antenna 721 is mounted. A backing layersuch as foam layer 726 can be provided at an interface between NFCmodule 210 and cowling 419.

FIG. 8 illustrates a partially exploded perspective view of the NFCmodule 210 of FIG. 7 , showing how foam layer 726 can be mounted tocowling 419 and provided with an adhesive layer 800 for attachment to anantenna assembly 805 including antenna 721. In the example of FIG. 8 ,cowling 419 includes an opening 803 through which a fastener such asscrew 802 can pass to secure cowling 419 to an interior surface ofhousing 104.

In the example of FIG. 8 , antenna assembly 805 includes antenna 721mounted to a portion of flexible printed circuit 212 that is supportedby stiffener layer 724. An adhesive layer 807 is provided on antennaassembly 805 for attachment of antenna assembly 805 interface portion404 (also referred to herein as a cap). Adhesive 722 for attachinginterface portion 404 to ledge 406 of housing 104 is also shown. In theexample of FIG. 8 , antenna 721 may be implemented as a coil antenna,and can be provided with or without an insert (e.g., a plastic ormagnetic core structure) around which the coil is wound. The coilantenna may be implemented as a wound coil or as a set of winding tracesin an etched printed circuit board. However, it should be appreciatedthat the example NFC module of FIG. 8 is merely illustrative, and otherimplementations for NFC module 210 are contemplated herein.

For example, FIG. 9 illustrates a partially exploded perspective view ofanother implementation of NFC module 210. In the example of FIG. 9 , NFCmodule 210 includes an antenna assembly 903 that includes antenna 721implemented as a wound coil that is wound around a support structuresuch as a core structure 906. Core structure 906 may be a plasticstructure that is provided primarily for support of antenna 721, or maybe a magnetic (e.g., ferrite) core that supports antenna 721 andenhances the efficiency of antenna 721.

In the example of FIG. 9 , antenna assembly 903 includes a portion offlexible printed circuit 212 that is supported by stiffener layer 924.Foam 910 is provided on stiffener layer 924, and one or moreencapsulations 908 are also provided on stiffener layer 724 (e.g., toencapsulate leads for antenna 721 as described in further detailhereinafter).

In the example of FIG. 9 , interface portion 404, which is implementedas a cap to be secured by adhesive 722 to housing 104 (e.g., to ledge406 and/or other portions of the opening 407 in recess 204), includes anextended portion 935 configured to extend over an around antenna 721 andcore structure 906 when NFC module 210 is assembled. A filler 912, suchas a glue, adhesive, or potting material can be provided betweeninterface portion 404 (also referred to herein as a cap) and antenna 721to secure antenna assembly 903 to interface portion 404 and/or to fillthe space between antenna assembly 903 and interface portion 404.

In the example of FIG. 9 , near-field communications module 210 includesan interface portion 404 having an outer surface 402 shaped and sized toform a portion of a surface 400 of the recess 204 in the device housing104 (e.g., as also illustrated in FIGS. 2, 4, 6, 7 discussed above andFIGS. 12 and 13 discussed hereinafter). In the examples of FIGS. 8 and 9, near-field communications module 210 may include a coil antenna 721coupled between the interface portion 404 and a flexible printed circuit212. In the example of FIG. 9 , near-field communications module 210includes a support structure such as a core structure 906 for the coilantenna, and the interface portion 404 includes an extended portion 935that extends over and around the coil antenna 721 and a portion of thecore structure 906.

FIG. 10 illustrates a top perspective view of antenna assembly 903 ofFIG. 9 . As shown in FIG. 10 , support structure 906 may include a baseportion 1033 that is secured to a magnetic layer 1006 (e.g., a ferritesheet) by a layer of adhesive 1008. Magnetic layer 1006 may be attached(e.g., using a layer of adhesive) to a surface 1035 of the portion offlexible printed circuit 212 that is supported by stiffener layer 924.Stiffener layer 924 may be attached to a portion of flexible printedcircuit 212 by a layer of adhesive 1004. In this example, stiffenerlayer 924, and the portion of flexible printed circuit 212 that issupported by stiffener layer 924, form a part of antenna assembly 903.

FIG. 10 also shows how leads 1000 from antenna 721 can extend around anedge of flexible printed circuit 212 and stiffener layer 924 toterminate on a side of stiffener layer 924 that is opposite to the sideon which antenna 721 is mounted (e.g., mounted via magnetic layer 1006and adhesive 1008, and support structure 906).

FIG. 11 illustrates a bottom perspective view of antenna assembly 903 ofFIGS. 9 and 10 , and shows how leads 1000 can terminate at landing pads1107 on a bottom surface 1109 of stiffener layer 924. Encapsulations 908are visible in FIG. 11 covering the ends of leads 1000 on surface 1109.Landing pads 1107 may, for example, be conductively coupled to one ormore traces within flexible printed circuit 212 (e.g., by one or moreconductive vias or other conductive structures or traces that extendthrough stiffener layer 924). Foam 910 may be attached to bottom surface1109 of stiffener layer 924 by a layer of adhesive 1100.

FIG. 12 illustrates a cross-sectional view of a portion of device 100,taken along line A-A of FIG. 6 , in an implementation in which NFCmodule 210 of FIG. 9 has been assembled and installed in housing 104such that an outer surface 402 of interface portion 404 of forms asmoothly contiguous surface with surface 400 of recess 204 of housing104, curving in coordination with curved portions of surface 400 in oneor more dimensions. In the example of FIG. 12 , interface portion 404 issecured to housing 104 by adhesive 722 that is disposed between variousvertical and horizontal interfacing surfaces between interface portion404 and an opening in housing 104, including between interface portion404 and a ledge 406 within the opening in housing 104 for NFC module210.

Ledge 406 provides support for interface portion 404 to counter, forexample, forces on surface 402 that press NFC module 210 toward theinterior of housing 104 (e.g., forces resulting from pressure from aband module housing pressed against surface 402 when a band is installedin recess 204, and/or fluid pressure such as water pressure on surface402 when device 100 is submerged in water). As discussed herein,although not explicitly shown in FIG. 12 , cowling 419 may be secured(e.g., by a screw 802) to housing 104 to further counter pressure thatmay be exerted on surface 402 (e.g., without providing an outwardpressure on NFC module 210 that would overcome the attachment byadhesive 722).

In the example of FIG. 12 , the device housing 104 includes an openingin the recess 204, the opening including a ledge 406, where part of theinterface portion 404 is attached to the ledge 406 (e.g., as alsoillustrated in FIGS. 4 and 7 discussed above and in FIG. 13 discussedhereinafter). The interface portion 404 of near-field communicationsmodule 210 and ledge 406 of the opening in the recess 204 cooperate toseal an internal cavity (see internal cavity 201 of FIG. 2 ) of the mainbody 101 against (e.g., at least three bar) fluid pressure on the outersurface 402 of the interface portion 404.

FIG. 13 illustrates another cross-sectional view of a portion of device100, taken along line B-B of FIG. 6 . In the cross-sectional view ofFIG. 13 , landing pads 1107 on stiffener layer 724 can be seen. In thecross-sectional views of FIGS. 12 and 13 , extended portion 935 ofinterface portion 404 can be seen extending over and around antenna 721and support structure 906, with filler 912 therebetween. In one or moreimplementations, the interface portion 404 may inserted into the opening407 from recess 204 and attached to the housing 104 by adhesive 722prior to inserting the NFC module 210 into the interface portion (e.g.,in an opposite direction to the insertion of interface portion 404 intothe opening 407) and attaching the NFC module 210 to the interfaceportion 404 (e.g., using an adhesive such as filler 912). In one or moreother implementations, the NFC module 210 may be attached to theinterface portion 404 and inserted into the opening 407 with theinterface portion 404 prior to attaching the flexible printed circuit212 to the NFC module 210. In the example of FIGS. 12 and 13 , antenna721 is formed by eight layers of four turns of a wire wound around corestructure 906, and supported by base portion 1033. However, this ismerely illustrative, and other configurations for antenna 721 (e.g.,more or fewer than four turns, more or fewer than eight layers, etc.)are contemplated.

As illustrated in the example of FIGS. 12 and 13 , wearable electronicdevice 100 may be provided with a device housing 104, processingcircuitry (see, e.g., processing circuitry 200 of FIG. 2 ) disposedwithin the device housing, a recess 204 on an edge of the devicehousing, and a near-field communications module 210 mounted within thedevice housing 104 adjacent to the recess 204 to read a uniqueidentifier of a band 108 having a portion mounted in the recess, theband configured to secure the device housing to a wearer, the near-fieldcommunications module including an antenna assembly 903 (e.g., orantenna assembly 805 of FIG. 8 ), and an interface portion 404 having anouter surface 402 that forms a portion of a surface 400 of the recess204. In the example of FIGS. 12 and 13 , the antenna assembly 903includes a coil antenna 721 that is wound around a core structure 906,where the interface portion 404 includes an extended portion 935 thatextends over and around the coil antenna 721 and part of the corestructure 906. In this example, the core structure 906 includes a base1033, and the antenna assembly 903 also includes a magnetic layer 1006attached to the base 1033. In this and other examples, the devicefurther includes a flexible printed circuit 212 coupled between theantenna assembly 903 and the processing circuitry 200. In this and otherexamples, the antenna module further includes a stiffener layer 924attached to a portion of the flexible printed circuit 212, and thestiffener layer 924 and the portion of the flexible printed circuit 212each form a portion of the near-field communications module 210.

As illustrated in the example of FIGS. 12 and 13 (e.g., and/or FIGS. 4and/or 7 ), the surface 400 of the recess 204 may have a curved shape,and the outer surface 402 of the interface portion 404 may have a shapethat conforms to the curved shape of the surface of the recess to form asmoothly continuous portion of the surface of the recess.

In the cross-sections of FIGS. 12 and 13 , it can be seen that extendedportion 935 of interface portion 404 has an open bottom that allowsextended portion 935 to extend over and around antenna 721 and at leastpart of core structure 906. The cross-sections of FIGS. 12 and 13 alsoillustrate how extended portion 935 runs around antenna 720 and corestructure 906 in a direction substantially parallel to the wire that iswound around core structure 906 to form antenna 720.

FIG. 14 illustrates an exploded perspective view of NFC module 208 ofband 108, in one implementation. As shown in FIG. 14 , NFC module 208may include a band module housing 702, within which antenna 720, memory706 (e.g., an NFC tag chip), and an antenna filler 1404 may be disposed.Antenna filler 1404 may be a plastic support structure or a magnetic(e.g., ferrite) structure that supports and/or enhances the efficiencyof antenna 721. In the example of FIG. 14 , antenna 720 is implementedas a wound coil. However, it should be appreciated that antenna 720 canbe implemented in other configurations, such as by one or more windingtraces in a printed circuit board. For example, FIG. 15 illustrates awound coil antenna 1500 formed from one or more windings of a wire 1501,and an antenna 1502 formed from winding traces 1506 in a printed circuitboard 1504. In various implementations, antenna 720 or antenna 721 canbe implemented using either of antenna 1500 or antenna 1502 of FIG. 15 .

FIG. 16 illustrates a partially exploded perspective view of NFC module208 in another implementation, and positioned for installation in recess500 in attachment portion 206 of band 108. As shown in FIG. 16 , in someimplementations, NFC module 208 can include an antenna assembly 1604configured to be secured within a band module housing 1602.

Band module housing 1602 may be formed from a hard or soft material invarious implementations, and can serve as a housing for NFC module 208and as a mechanical bumper for band 108 (e.g., a bumper that isspatially complementary to, and formed from the same material as apassive bumper 300 on the same side of band 108 and/or a passive bumperon an opposing side of band 108). For example, in implementations inwhich attachment portion 206 of band 108 is formed from a relativelysoft material such as a rubber, flouroelastomer, leather, woven nylon,etc., band module housing 1602 may be formed from a relatively hardmaterial such as a reinforced polymer (e.g., a glass fiber reinforcedpolymer). In implementations in which attachment portion 206 of band 108is formed from a relatively hard material such as a metal (e.g.,stainless steel), band module housing 1602 can be formed from arelatively soft material such as a rubber or a flouroelastomer.

Band module housing 1602 may be formed, for example, from a materialthat is opaque to visible light and transparent to electromagneticfields generated by antenna 721 in NFC module 210 and antenna 720 in NFCmodule 208. Band module housing 1602 and/or the cap (interface portion404) of NFC module 210 may be formed from a material that iselectrically insulating so that the communicative coupling between band108 and device 100 is an inductive (NFC) coupling (e.g., without anydirect conductive contact between NFC module 208 and NFC module 210).This can be helpful in comparison with providing more complex circuitry(e.g., integrated circuits, displays, or the like) in a smart watch bandthat would either consume the limited power stored in the device and/orrequire larger and potentially bulky features in the band to accommodatepower storage in the band. Band module housing 1602 may be formed from amaterial having a color that matches the color of one more passivebumpers in band 108 such as bumper 704 of FIG. 7 and/or bumper 300 ofFIG. 3 .

Antenna assembly 1604 can be secured within band module housing 1602 byan adhesive such as a glue 1606. Once assembled, NFC module 208 can besecured within recess 500 in band 108 by an adhesive 1608. Adhesive 1608may be a pressure sensitive adhesive (PSA), an epoxy, or other adhesivematerial. In other implementations, NFC module 208 can be overmolded inthe material of band 108 (e.g., attachment portion 206) or can besecured within recess 500 by mechanical structures. Securing NFC module208 in recess 500 using epoxy, overmolding, or mechanical structures canhelp ensure destruction of NFC module 208 if NFC module 208 is removedfrom recess 500. This can be helpful in circumstances in which theidentifier of band 108 is used to authenticate the band or authorize oneor more features associated with the band. However, in otherimplementations, a PSA may be used to secure NFC module 208 in recess500 so that NFC module 208 can be removed, repaired, replaced, and/orshared with other bands.

As illustrated in the example of FIG. 16 , near-field communicationsmodule 208 includes a band module housing 1602 having an outer surface1607 that forms a portion of a surface 1609 of the attachment portion206 of the removable band 108 when NFC module 208 is assembled intorecess 500 (e.g., as also illustrated in the examples of FIGS. 2, 3, 5,and 7 ). In the examples of FIGS. 14 and 16 , near-field communicationsmodule 208 includes a coil antenna such as coil antenna 720 and a memorychip such as memory 706 or memory 1621 disposed within the band modulehousing.

In the example of FIG. 16 , antenna assembly 1604 includes a substrate1616 having a first surface 1617 on which antenna 720 is mounted. In theexample, antenna 720 is wound around a core structure 1612 (e.g., aplastic support structure or a ferrite support structure for enhancementof the performance of antenna 720) that is also mounted on surface 1617.Additional circuitry such as a capacitor 1614 can also be mounted tosurface 1617 of substrate 1616. In the example of FIG. 16 , memory 1621(e.g., memory storing a unique identifier for NFC module 208 and thusband 108) is mounted to an opposing side of substrate 1616.

Glue 1606 may be arranged to surround antenna assembly 1604 and fill aspace between antenna assembly 1604 and band module housing 1602. Forexample, FIG. 17 illustrates a partially exploded bottom view of NFCmodule 208 of FIG. 16 , in which a cavity 1700 within band modulehousing 1602 can be seen. Antenna assembly 1604 can be secured withincavity 1700 by glue 1606 filling the cavity 1700 around antenna assembly1604. FIG. 17 also shows how the substrate 1616 can include alignmentfeatures 1790 that engage with corresponding alignment features 1791 onthe band module housing 1602 to align and position the antenna assembly1604 within the cavity 1700. Alignment features 1791 include a recess inan edge of the band module housing 1602 in the example of FIG. 17 , butcan include other features (e.g., recesses, protrusions, or the likeformed on one or more interior surfaces of the cavity 1700) in variousimplementations.

As shown in FIG. 17 , memory 1621 (e.g., an NFC tag chip) is mounted toopposing surface 1702 of substrate 1616. Antenna assembly 1604 may alsoinclude conductive structures 1712 that extend between memory 1621 andleads 1710 for antenna 720. As shown, leads 1710 may extend around anedge of substrate 1616 to contact conductive structures 1712.

As illustrated in the example of FIGS. 16 and 17 , a band such as band108 for a wearable electronic device such as wearable electronic device100 can include an attachment portion 206 configured to be received in arecess 204 in a device housing 104 of the wearable electronic device toremoveably attach the band to the device housing, and can include abumper in the attachment portion 206 to facilitate insertion of theattachment portion 206 of the band 108 into the recess 204 in the devicehousing 104, where the bumper includes a band module housing 1602 havingan outer surface 1607 that forms a portion of an outer surface 1609 ofthe attachment portion 206 of the band 108, and the bumper also includenear-field communications circuitry (e.g., antenna assembly 1604)disposed in a cavity 1700 in the band module housing 1602, thenear-field communications circuitry including unique identifier (e.g.,stored in memory chip 1621) for the band. The near-field communicationscircuitry of the bumper (e.g., an active bumper) can include a substrate1616, memory 1621 mounted to the substrate (the memory storing theunique identifier for the band) and an antenna 720 configured to bepowered by additional near-field communications circuitry (e.g., NFCmodule 210) in the device housing 104 of the wearable electronic device100 to transmit the unique identifier to the wearable electronic device.The near-field communications circuitry of the bumper can also include acapacitor 1614 mounted to the substrate 1616, and conductive structures1712 (e.g., overmolded in the substrate) that extend between contactsfor the capacitor 1614, the memory 1621, and the antenna 720.

FIG. 18 illustrates a cross-sectional view of part of attachment portion206 of band 108 with the NFC module 208 of FIGS. 16 and 17 installedtherein. As shown in FIG. 18 , an outer surface 1811 of band modulehousing 1602 may form portion of the surface of attachment portion 206.Adhesive 1608 is disposed between substrate 1616 and a bottom surface ofthe recess 500 in band 108 to secure NFC module 208 therein. Glue 1606can also be seen surrounding the components of antenna assembly 1604 andfilling the space between antenna assembly 1604 and band module housing1602.

In the cross-sectional view of FIG. 18 , bumper 704 on the opposing sideof band 108 can be seen attached within a recess 1802 in attachmentportion 206 by an adhesive 1808. In this configuration, outer surface1811 of band module housing 1602 and outer surface 1809 of bumper 704form opposing portions of the outer surface of attachment portion 206that facilitate installation and removal (e.g., by facilitating slidingwithin recess 204 with a desirable amount of sliding resistance) of band108 to and from recess 204.

As illustrated in, for example, FIG. 18 (and/or FIGS. 2, 3, 7 , and/or16) NFC module 208 may form an active bumper for a removable band 108,in which the band module housing 1602 is configured to bear againstsurface 400 of recess 204 when the attachment portion 206 is within therecess 204. As described herein, band 108 may also include one or morepassive bumpers such as bumper 300 or bumper 704 (e.g., on a same sideor on an opposing side of band 108 as the side in which NFC module 208is disposed) at least partially embedded within the attachment portion206 of the band and configured to bear against surface 400 of recess 204when the attachment portion 206 is within the recess 204.

The cross-sectional view of FIG. 18 also illustrates how a bumper formedby NFC module 208 (e.g., by band module housing 1602) can be disposed ina first recess 500 in a first side 1823 of the attachment portion 206 ofthe band 108, and the band 108 can also include a passive bumper 704disposed in a second recess 1802 on an opposing second side of theattachment portion 206 of the band 108. The passive bumper 704 and theband module housing 1602 may be formed from a common material or fromdifferent materials. Forming the passive bumper 704 and the band modulehousing 1602 from a common material may be beneficial for providinguniform resistance to movement of band 108 within and/or along recess204.

As described above in connection with, for example, FIGS. 3 and 5 , anadditional passive bumper 300 may be disposed in an additional recess inthe first side of the attachment portion 206 of the band 108, and anengagement member 302 may also be disposed between the bumper formed byNFC module 208 and the additional passive bumper 300 on the first sideof the attachment portion 206.

FIG. 19 illustrates a cross-sectional view of antenna assembly 1604,taken along a line in which the contours of conductive structures 1712can be seen. As shown in FIG. 19 , conductive structures 1712 can extendfrom capacitor 1614 on surface 1617 of substrate 1616, through substrate1616 to contact memory 1621 on surface 1702, and beyond memory 1621 toform contact pads for leads 1710 from antenna 720. In the example ofFIG. 19 , leads 1710 are encapsulated by encapsulant 1933 on surface1702. Conductive structures 1712 can be formed, for example, from insertmolded stamped copper rails. As shown in FIG. 19 , antenna 720 may belaterally offset from a center of substrate 1616 to allow for symmetricpositioning of NFC module 208 and bumper 300 and for alignment ofantenna 720 with antenna 721 of NFC module 210.

FIG. 20 illustrates a cross-sectional view of NFC module 208 of FIGS.16-19 positioned opposite antenna assembly 903 of NFC module 210 ofFIGS. 9-13 , as they would be positioned, respectively in band 108 andhousing 104, when band 108 is attached within recess 204 of housing 104.In order for antenna 721 of NFC module 210 of main body 101 of device100 to inductively power antenna 720, and for antenna 720 to transmitthe identifier stored in memory 1621 to antenna 721, the attachmentportion 206 of the removable band 108 and the recess 204 in the devicehousing 104 are configured (e.g., in cooperation with the interfaceportion 404 of NFC module 210 and the band module housing 1602 of NFCmodule 208) to position antenna 721 of near-field communications module210 at a predetermined distance 2000 from antenna 720 of the near-fieldcommunications module 208. Predetermined distance 2000 may be, forexample, less than five millimeters, less than one millimeter, less than0.75 millimeters, less than 0.6 millimeters, between 0.25 and 0.75millimeters, or between 0.4 and 0.6 millimeters (as examples). Thearrangement of NFC module 208, NFC module 210, band 108, housing 104,and/or recess 204 as described herein allow antenna 720 and antenna 721to be positioned for powering and communication as described, whilemaintaining water resistance for the internal cavity of housing 104, andproviding the mechanical and aesthetic benefit of symmetric bumperfunctionality for the NFC module 208.

As illustrated in the example of FIG. 20 , the cross-sectional width(e.g., and/or the cross-sectional length) of antenna 720 may be smallerthan the corresponding cross-sectional width (e.g., and/or thecross-sectional length) of antenna 721 in some implementations. Thus, inan attached configuration for band 108, while antenna 720 and antenna721 may be axially aligned, antenna 720 and antenna 721 may havedifferent footprints when viewed the axes of the antennas.

As described herein, in various implementations, band module housing1602 can be formed from a rigid material such as a glass-fiberreinforced polyamide to provide a smooth hard outer surface 1811 forproviding bumper functionality for NFC module 208. However, as alsonoted herein, in some implementations, attachment portion 206 can beformed from a rigid material such as a metal. FIG. 21 illustrates across-sectional view of attachment portion 206 of a band 108 that isformed from a rigid material 2100 (e.g., a metal such as stainlesssteel). In the example of FIG. 21 , band module housing 1602 is embeddedwithin a relatively softer material 2102 (e.g., a flouroelastomer orother resiliently compressible material). In this example, a layer 2121of material 2102 is formed over the outer surface of band module housing1602 so that both of opposing outer surfaces 1809 and 1811 formrelatively soft bumper surfaces for attachment portion 206. In thisexample material 2102 can be resiliently compressible so that, whenattachment portion is pressed into recess 204, material 2102 compressesto allow insertion of band 108 into the recess 204 while resilientlyproviding an outward force between surfaces 1809 and 1811 and thesurface 400 of recess 204 to facilitate sliding of band 108 into recess204 with a desirable amount of frictional resistance.

In the example of FIG. 21 , an NFC module 208 having a band modulehousing 1602 and an antenna assembly 1604 disposed within a cavity inthe band module housing is embedded in the material 2102. However, insome implementation, an embedded NFC module may be provided in anelastomeric material without the band module housing.

For example, FIG. 22 illustrates an implementation in which the antennaassembly 1604 is coated with a first material 2200, such as a resin or apolymer (e.g., a thermosetting polymer such as epoxy), after which theantenna assembly 1604 coated with the first material 2200 can beembedded (e.g., overmolded) in the material 2102. In the example of FIG.22 , the layer 2121 of material 2102 is formed over an outer surface offirst material 2200 so that both of opposing outer surfaces 1809 and1811 (see, e.g., FIG. 21 ) form relatively soft bumper surfaces forattachment portion 206.

Various examples of implementations of NFC modules 208 and NFC modules210 are described herein in connection with, for example, FIGS. 7-21 .However, it should be appreciated that other implementations of NFCmodule 208 and other implementations of NFC module 210 are contemplatedherein.

For example, FIG. 23 illustrates an implementation of NFC module 208with a reduced size in multiple dimensions, and for which simplifiedmanufacturing can be applied. In the example of FIG. 23 , antennaassembly 1604 includes a substrate 1616 having a first surface 1617 onwhich antenna 720 is mounted. In the example, antenna 720 is woundaround a core structure 1612 (e.g., a plastic support structure or aferrite support structure for enhancement of the performance of antenna720) that is also mounted on surface 1617. Additional circuitry such asa capacitor 1614 can also be mounted to surface 1617 of substrate 1616.In the example of FIG. 23 , leads 1710 of the coil of antenna 720contact conductive structures 1712 on the same side of antenna assembly1604 as surface 1617 of substrate 1616 (e.g., without extending aroundan edge of the substrate 1616). Forming the contacts between leads 1710and conductive structures 1712 on the same side of antenna assembly 1604as surface 1617 of substrate 1616 as in FIG. 23 can reduce thecomplexity of the manufacturing process for antenna assembly 1604 and/orfacilitate a simplified manufacturing process for antenna assembly 1604(e.g., by allowing the wire for the antenna 720 to be wound around thecore structure 1612 and leads 1710 to be coupled to conductivestructures 1712 in an automated process).

In the example of FIG. 23 , circuitry 2321 is mounted in a recess 2300in the substrate 1616 (e.g., a recess in the opposing side of substrate1616 from the side on which antenna 720 and capacitor 1614 are mounted).Circuitry 2321 may be, for example, an implementation of memory 1621described herein, or may be an integrated circuit that includes memory(e.g., storing a unique identifier for NFC module 208 and thus band 108)and/or additional processing circuitry. Circuitry 2321 may be configuredto processes NFC communications from NFC module 210 and received byantenna 720, to manage communications to NFC module 210 using antenna720, and/or to manage RF power received from NFC module 210 at antenna720. Mounting the memory 1621 in the recess 2300 as in the example ofFIG. 23 can reduce the z-height of the antenna assembly 1604, which canbe helpful for implementations of the NFC module in bands 108 that areformed from certain band materials (e.g., braided bands that have rigidattachment portions 206 and soft bumpers).

As another example, FIG. 24 illustrates an implementation of an antennaassembly 1604 of NFC module 208 in which circuitry 2321 is mounted inthe recess 2300 in substrate 1616, and antenna 720 is provided in amulti-coil arrangement. As shown in the example of FIG. 24 , in one ormore implementations, the antenna assembly 1604 may include an antenna720 that includes two coils 2420 and 2421 (e.g., a pair of coils) thatare each wound around a respective core structure 2412 and 2413 (e.g., apair of corresponding core structures or support structures) that aremounted on, or formed as protrusions from, surface 1617. Core structure2412 for coil 2420 may be a plastic or other insulating supportstructure or a ferrite support structure for enhancement of theperformance of antenna 720 in various implementations. Core structure2413 for coil 2421 may be a plastic or other insulating supportstructure or a ferrite support structure for enhancement of theperformance of antenna 720 in various implementations.

FIG. 25 illustrates a top view of the antenna assembly 1604 of FIG. 24 ,in which the two coils 2420 and 2421 and their respective corestructures 2412 and 2413, and leads 1710 can be seen. In the top view ofFIG. 25 , portions 2500 of the single wire forming both coils of antenna720 are visible extending between the two coils 2420 and 2421. In one ormore implementations, an NFC module 208 having a multi-coil antennamodule, as in the example of FIGS. 24 and 25 , can communicate with a(e.g., mirrored) multi-coil antenna module in housing 104 to form one ormore magnetic flux loops through the multi-coil antennas that canfacilitate providing, exchanging, and/or receiving identification,power, and/or other communications between the processing circuitry ofthe wearable device 100 and the band 108.

FIG. 26 illustrates a partially exploded perspective view of structuresfor mounting another implementation of NFC module 210 in the housing104. As shown in FIG. 26 , NFC module 210 may be mounted a flexibleprinted circuit 212 that is implemented with connection features such asPlated Through-Hole (PTH) features 2600 for coupling the flexibleprinted circuit 212 to conductive contacts on the NFC module 210 (e.g.,and thus to the leads for antenna 721). In this example, flexibleprinted circuit 212 may be attached by a foam and/or adhesive structure2602 to cowling 419, which can be attached to an interior surface ofhousing 104 such as by screw 802 as described herein.

FIG. 27 illustrates an exploded perspective view of the antenna assembly903 of FIG. 26 . In the example of FIG. 27 , antenna assembly 903includes antenna 721 implemented as a wound coil that is wound around acore structure 906. Core structure 906 may be a plastic structure thatis provided primarily for support of antenna 721, or may be a magnetic(e.g., ferrite) core that supports antenna 721 and enhances theefficiency of antenna 721.

In the example of FIG. 27 , antenna assembly 903 includes an adhesivelayer 2702 for attaching core structure 906 to a magnetic layer 2704such as a ferrite sheet. The magnetic layer 2704 may be attached to aninterposer 2706, and a patterned adhesive layer 2708 may be provided onan opposing side of the interposer 2706 (e.g., to attach the antennaassembly 903 to the flexible printed circuit 212).

FIG. 27 also shows how core structure 906 may have a base portion 1033that includes cutouts 2700 that allow leads 1000 from antenna 721 toextend past the base portion of the core structure and around an edge ofinterposer 2706 to terminate on a side of interposer 2706 that isopposite to the side on which antenna 721 is mounted (e.g., mounted viamagnetic layer 2704 and adhesive layer 2702, and support structure 906).

FIG. 28 illustrates a bottom perspective view of antenna assembly 903 ofFIG. 27 in an assembled configuration and attached to flexible printedcircuit 212. FIG. 28 shows how leads 1000 can terminate on a bottomsurface of interposer 2706 and interposer 2706 can be communicativelycoupled to flexible printed circuit 212 using PTH features 2600 (orother electrical connecting structures or materials).

FIG. 29 illustrates a top perspective view of antenna assembly 903 inother implementation. In the example of FIG. 29 , interposer 2706includes extensions 2900 on which contact pads 2902 are formed. In thisexample, leads 1000 of the antenna 721 are conductively coupled tocontact pads 2902 on the same side of interposer 2706 on which supportstructure 906 is mounted. In this example, base portion 1033 ispartially disposed in a recess 2904 in the surface of the interposer2706 on which the contact pads 2902 are formed.

FIG. 30 illustrates another implementation of NFC module 210, in whichthe antenna assembly 903 is provided in a multi-coil arrangement. Forexample, the multi-coil arrangement of NFC module 210 may be disposed inhousing 104 to form a mirrored pair of coils with the coils 2420 and2421 of the multi-coil arrangement of NFC module 208 shown in FIGS. 24and 25 . In the example of FIG. 30 , antenna 721 of NFC module 210includes multiple coils (e.g., two coils 3021 and 3022 formed from twowindings of a single wire) wound around multiple respective corestructures (e.g., two parallel support structures such as corestructures 3031 and 3032). In this example, core structures 3031 and3032 are portions of the core structure 906 that extend (e.g.,vertically and in parallel) from the base portion 1033 of the corestructure 906. Core structure 906, including base portion 1033 and therespective core structures 3031 and 3032 for the coils 3021 and 3022,may be a plastic structure that is provided primarily for support ofantenna 721, or may be a magnetic (e.g., ferrite) core that supportsantenna 721 and enhances the efficiency of antenna 721.

In the example of FIG. 30 , base portion 1033 of core structure 906 ispartially disposed in a recess in an interposer 2706. In this example,interposer 2706 also includes a ledge 3000 on which leads 1000 fromantenna 720 are conductively coupled to conductive pads. In thisconfiguration, conductive structures of the interposer 2706 (notexplicitly visible in FIG. 30 ) couple the pads on ledge 3000 (to whichthe leads 1000 are coupled) to the flexible printed circuit 212. Inconfigurations in which the multi-coil arrangement of NFC module 210 ismounted in housing 104, the multi-coil arrangement of NFC module 208 ismounted in band 108, and band 108 is mounted in the recess 204 in thehousing 104, coils 2420 and 2421 of NFC module 208 and coils 3021 and3022 of NFC module 210 may form mirrored pairs of coils that can be usedto communicate power, identifiers, and/or other information and/orsignals between the band 108 and the processing circuitry of thewearable electronic device 100.

Various examples are described herein (e.g., in connection with FIGS. 7,9, 12, and 13 ) in which adhesive 722 that extends around the peripheryof interface portion 404 attaches the interface portion 404 within theopening 407 in recess 204 of housing 104. However, it should beappreciated that other implementations of interface portion 404, and theattachment between the interface portion 404 and the housing 104, arecontemplated.

For example, FIG. 31 illustrates an implementation in which an adhesivefilm 3100 (e.g., a heat activated film (HAF)) is disposed between theledge 406 in opening 407 and the interface portion 404. In the exampleof FIG. 31 , the interface portion 404 may be inserted into the opening407 in the direction 3102, and the adhesive film 3100 can be cured(e.g., by application of heat). Once the interface portion 404 is bondedto the ledge 406 by adhesive film 3100, adhesive 722 may be dispensedinto a gap 3104 between the extended portion 935 of the interfaceportion 404 and the opening 407 to attach the interface portion 404within the opening 407. In this example, the adhesive film 3100 canprovide a barrier or glue dam, during dispensing of adhesive 722, thatprevents the adhesive 722 from passing into the recess 204.

In the example of FIG. 31 , the adhesive film 3100 can extend around theentire periphery of the interface portion, or can be disposed along oneor more (e.g., discontinuous) portions of the periphery. For example,FIG. 32 illustrates a top perspective view of interface portion 404 inwhich adhesive film 3100 is formed on two end portions 3200 of theperiphery of the interface portion 404, with a gap 3202 in the adhesivefilm 3100 along one or more of the edges of the periphery of theinterface portion 404. As shown in FIG. 33 , in the implementation ofFIG. 32 , along the edges of the periphery of the interface portion 404,the gap 3202 can be filled with adhesive 722 that is dispensed into thegap 3104. In this way (e.g., by providing a gap 3202 in the adhesivefilm 3100), the width of the interface portion 404 (e.g., along thedirection A-A of FIG. 6 ) can be reduced, which can facilitate slidingof the band 108 into and out of the recess 204 in some implementations.

FIG. 34 illustrates another implementation of interface portion 404. Inthe example of FIG. 34 , the interface portion 404 includes a gasket3400 (e.g., an overmolded silicon gasket). In this example, theinterface portion 404 (including the gasket 3400) may be inserted intothe opening 407 from within the housing (e.g., in the direction 3402),and gasket 3400 may act as a barrier to adhesive 722 when adhesive 722is then dispensed into the gap 3104. In the example of FIG. 34 , opening407 is provided without a ledge 406, and interface portion 404 isprovided without an overhanging portion that rests on the ledge. In thisway, the width of the opening 407 in the recess 204 may be reduced(e.g., along the direction A-A of FIG. 6 ), which can facilitate slidingof the band 108 into and out of the recess 204 in some implementations.FIG. 35 illustrates a top perspective view of the gasket 3400 extendingaround the periphery of the interface portion 404.

In the configuration of FIG. 34 , opening 407 may include features suchas features 3404 that can be filled with the dispensed adhesive 722 toprovide add strength to withstand a predetermined amount of pressure(e.g., one bar, two bar, three bar, five bar, at least five bar, or morethan five bar), such as to provide a desired water resistance forwearable electronic device 100. FIG. 36 illustrates a configuration inwhich an interface portion 404 that includes a gasket 3400 can beinserted (e.g., in a direction 3602 from the recess 204) into an opening407 that tapers in the direction 3602, so that (in an assembledconfiguration) pressure from the band and/or fluid in the recess 204presses the interface portion 404 into compression to help withstand apredetermined amount of pressure (e.g., one bar, two bar, three bar,five bar, at least five bar, or more than five bar), such as to providea desired water resistance for wearable electronic device 100. In theexample of FIG. 34 , the interface portion 404 also includes aprotrusion 3600 extending from the extended portion 935, that can beattached by adhesive 722 to a ledge 3604 on the tapered opening 407.

In various examples described herein (e.g., in connection with FIGS. 7,9, 12, 13, and 31-36 ), interface portion 404 is formed separately fromthe housing 104 and installed in an opening 407 therein using, forexample, adhesive 722 and/or other attachment materials and/ormechanisms. However, it should be appreciated that, in one or moreimplementations, the interface portion 404 for NFC module 210 may beintegrally formed with the housing 104 (e.g., to provide a seamless,co-finished surface 400 within the recess 204, in which the outersurface of the cap forms a co-finished portion of the surface of therecess in the device housing).

For example, FIG. 37 illustrates an example in which the interfaceportion 404 is formed by a cured adhesive material 3700 (e.g., athermosetting polymer or resin such as an epoxy material). In thisexample, the interface portion 404 may be integrally formed with thehousing 104 by machining a pocket into the housing 104 prior to formingthe recess 204, filling the pocket with the adhesive material 3700 andcuring the adhesive material 3700, and then machining the recess 204 inthe housing material for housing 104 in which the cured adhesivematerial 3700 is already disposed. In this way, the outer surface 402 ofthe interface portion 404 and the surface 400 of the recess 204 can beformed in a common machining process. In this example, the extendedportion 935 of the interface portion 404 may also be formed by machininga cavity in the cured adhesive for insertion/attachment of the coil ofantenna 720 of NFC module 210.

In the example of FIG. 37 , the interface portion 404 is entirely formedfrom the cured and machined adhesive material 3700. However, in otherimplementations, an interface portion 404 that is integrally formed withthe housing 104 (e.g., to provide a seamless, co-finished surface 400within the recess 204, as illustrated in FIG. 37 ) may be formed usingother materials and/or processes. For example, instead of curing andmachining the adhesive material 3700, the interface portion 404 may beintegrally formed with the housing 104 by machining a pocket into thehousing 104 prior to forming the recess 204, and forming the interfaceportion in the pocket using a direct injection molding process. Forexample, a thermoplastic or thermosetting polymer material may be directinjection molded into the machined pocket, and then the recess 204 maybe machined in the housing material for housing 104 in which theinjection molded material is already disposed. In this way, the outersurface 402 of the interface portion 404 formed by direct injectionmolding, and the surface 400 of the recess 204, can be formed in acommon machining process. In this example, the extended portion 935 ofthe interface portion 404 may be formed using an appropriately shapedmold structure during the injection molding process, or can also beformed by machining a cavity in the injection molded material forinsertion/attachment of the coil of antenna 720 of NFC module 210.

In yet other implementations, an interface portion 404 that isintegrally formed with the housing 104 (e.g., to provide a seamless,co-finished surface 400 within the recess 204) may be formed from morethan one material. For example, FIG. 38 illustrates an example in whichthe interface portion 404 is formed by a first material 3800 (e.g., aplastic material or other polymer) and a cured adhesive material 3802(e.g., a thermosetting polymer or resin such as an epoxy material). Inthis example the interface portion 404 may be integrally formed with thehousing 104 by machining a pocket into the housing 104 prior to formingthe recess 204, attaching a plug formed from the first material 3800 inthe machined pocket with the adhesive material 3802 (and curing theadhesive material), and then machining the recess 204 in the housingmaterial for housing 104 in which the plug and the cured adhesivematerial 3802 is already disposed. In this way, the outer surface 402 ofthe interface portion 404 (e.g., substantially formed by the firstmaterial 3800) and the surface 400 of the recess 204 can be formed in acommon machining process. In this example, the extended portion 935 ofthe interface portion 404 may also formed by machining a cavity in theplug formed by the first material 3800, for insertion/attachment of thecoil of antenna 720 of NFC module 210.

In accordance with aspects of the disclosure, a wearable device systemis provided that includes a main body. The main body includes a devicehousing, processing circuitry disposed within the device housing, arecess on an edge of the device housing, and a first near-fieldcommunications module mounted within the device housing adjacent to therecess. The wearable device system also includes a band configured tosecure the main body to a wearer, the band including an attachmentportion configured to be received in the recess in the device housing toremoveably attach the band to the main body, and a second near-fieldcommunications module at least partially embedded within the attachmentportion and including an identifier for the band. In an attachedconfiguration for the band, the attachment portion of the band and therecess in the device housing are configured to align the firstnear-field communications module with the second near-fieldcommunications module.

In accordance with other aspects of the disclosure, a band for awearable electronic device is provided that includes an attachmentportion configured to be received in a recess in a device housing of thewearable electronic device to removeably attach the band to the devicehousing, and a bumper in the attachment portion to facilitate insertionof the attachment portion of the band into the recess in the devicehousing. The bumper includes a band module housing having an outersurface that forms a portion of an outer surface of the attachmentportion of the band and near-field communications circuitry disposed ina recess in the band module housing, the near-field communicationscircuitry comprising a unique identifier for the band.

In accordance with aspects of the disclosure, a wearable electronicdevice is provided that includes a device housing, processing circuitrydisposed within the device housing, a recess on an edge of the devicehousing, and a near-field communications module mounted within thedevice housing adjacent to the recess to read a unique identifier of aband having a portion mounted in the recess, the band configured tosecure the device housing to a wearer. The near-field communicationsmodule includes an antenna module and a cap having an outer surface thatforms a portion of a surface of the recess.

A reference to an element in the singular is not intended to mean oneand only one unless specifically so stated, but rather one or more. Forexample, “a” module may refer to one or more modules. An elementproceeded by “a,” “an,” “the,” or “said” does not, without furtherconstraints, preclude the existence of additional same elements.

Headings and subheadings, if any, are used for convenience only and donot limit the invention. The word exemplary is used to mean serving asan example or illustration. To the extent that the term include, have,or the like is used, such term is intended to be inclusive in a mannersimilar to the term comprise as comprise is interpreted when employed asa transitional word in a claim. Relational terms such as first andsecond and the like may be used to distinguish one entity or action fromanother without necessarily requiring or implying any actual suchrelationship or order between such entities or actions.

Phrases such as an aspect, the aspect, another aspect, some aspects, oneor more aspects, an implementation, the implementation, anotherimplementation, some implementations, one or more implementations, anembodiment, the embodiment, another embodiment, some embodiments, one ormore embodiments, a configuration, the configuration, anotherconfiguration, some configurations, one or more configurations, thesubject technology, the disclosure, the present disclosure, othervariations thereof and alike are for convenience and do not imply that adisclosure relating to such phrase(s) is essential to the subjecttechnology or that such disclosure applies to all configurations of thesubject technology. A disclosure relating to such phrase(s) may apply toall configurations, or one or more configurations. A disclosure relatingto such phrase(s) may provide one or more examples. A phrase such as anaspect or some aspects may refer to one or more aspects and vice versa,and this applies similarly to other foregoing phrases.

A phrase “at least one of” preceding a series of items, with the terms“and” or “or” to separate any of the items, modifies the list as awhole, rather than each member of the list. The phrase “at least one of”does not require selection of at least one item; rather, the phraseallows a meaning that includes at least one of any one of the items,and/or at least one of any combination of the items, and/or at least oneof each of the items. By way of example, each of the phrases “at leastone of A, B, and C” or “at least one of A, B, or C” refers to only A,only B, or only C; any combination of A, B, and C; and/or at least oneof each of A, B, and C.

It is understood that the specific order or hierarchy of steps,operations, or processes disclosed is an illustration of exemplaryapproaches. Unless explicitly stated otherwise, it is understood thatthe specific order or hierarchy of steps, operations, or processes maybe performed in different order. Some of the steps, operations, orprocesses may be performed simultaneously. The accompanying methodclaims, if any, present elements of the various steps, operations orprocesses in a sample order, and are not meant to be limited to thespecific order or hierarchy presented. These may be performed in serial,linearly, in parallel or in different order. It should be understoodthat the described instructions, operations, and systems can generallybe integrated together in a single software/hardware product or packagedinto multiple software/hardware products.

In one aspect, a term coupled or the like may refer to being directlycoupled. In another aspect, a term coupled or the like may refer tobeing indirectly coupled.

Terms such as top, bottom, front, rear, side, horizontal, vertical, andthe like refer to an arbitrary frame of reference, rather than to theordinary gravitational frame of reference. Thus, such a term may extendupwardly, downwardly, diagonally, or horizontally in a gravitationalframe of reference.

The disclosure is provided to enable any person skilled in the art topractice the various aspects described herein. In some instances,well-known structures and components are shown in block diagram form inorder to avoid obscuring the concepts of the subject technology. Thedisclosure provides various examples of the subject technology, and thesubject technology is not limited to these examples. Variousmodifications to these aspects will be readily apparent to those skilledin the art, and the principles described herein may be applied to otheraspects.

All structural and functional equivalents to the elements of the variousaspects described throughout the disclosure that are known or later cometo be known to those of ordinary skill in the art are expresslyincorporated herein by reference and are intended to be encompassed bythe claims. Moreover, nothing disclosed herein is intended to bededicated to the public regardless of whether such disclosure isexplicitly recited in the claims. No claim element is to be construedunder the provisions of 35 U.S.C. §112, sixth paragraph, unless theelement is expressly recited using the phrase “means for” or, in thecase of a method claim, the element is recited using the phrase “stepfor”.

The title, background, brief description of the drawings, abstract, anddrawings are hereby incorporated into the disclosure and are provided asillustrative examples of the disclosure, not as restrictivedescriptions. It is submitted with the understanding that they will notbe used to limit the scope or meaning of the claims. In addition, in thedetailed description, it can be seen that the description providesillustrative examples and the various features are grouped together invarious implementations for the purpose of streamlining the disclosure.The method of disclosure is not to be interpreted as reflecting anintention that the claimed subject matter requires more features thanare expressly recited in each claim. Rather, as the claims reflect,inventive subject matter lies in less than all features of a singledisclosed configuration or operation. The claims are hereby incorporatedinto the detailed description, with each claim standing on its own as aseparately claimed subject matter.

The claims are not intended to be limited to the aspects describedherein, but are to be accorded the full scope consistent with thelanguage of the claims and to encompass all legal equivalents.Notwithstanding, none of the claims are intended to embrace subjectmatter that fails to satisfy the requirements of the applicable patentlaw, nor should they be interpreted in such a way.

What is claimed is:
 1. A near-field communications module, comprising: asubstrate; a recess in a first side of the substrate; near-fieldcommunications circuitry mounted in the recess; at least one corestructure extending from a second side of the substrate, the second sideopposite the first side; at least one coil on the at least one corestructure; a conductive structure that extends through a portion of thesubstrate and that includes a first portion that forms a contact pad onthe second side of the substrate and a second portion that isconductively coupled to the circuitry mounted in the recess; and atleast one conductive lead extending from the at least one coil intoconductive contact with the contact pad on the second side of thesubstrate.
 2. The near-field communications module of claim 1, whereinthe conductive structure is overmolded in the substrate.
 3. Thenear-field communications module of claim 1, wherein the near-fieldcommunications circuitry comprises an integrated circuit that includesmemory storing an identifier for the near-field communications module.4. The near-field communications module of claim 1, wherein the at leastone core structure comprises a pair of core structures, and wherein theat least one coil comprises a pair of coils on the pair of corestructures.
 5. The near-field communications module of claim 4, whereinthe at least one conductive lead comprises a pair of conductive leads atopposing ends of a single wire that is wound around the pair of corestructures to form the pair of coils.
 6. The near-field communicationsmodule of claim 5, further comprising a capacitor mounted to the secondside of the substrate and conductively coupled to the conductivestructure.
 7. The near-field communications module of claim 1, furthercomprising a housing having a cavity, wherein the substrate, thecircuitry, the at least one core structure, the at least one coil, theconductive structure, and the at least one conductive lead are disposedin the cavity.
 8. The near-field communications module of claim 7,wherein the housing comprises a band module housing that is configuredto form a bumper for a band of a wearable electronic device.
 9. Anear-field communications module, comprising: a support structure thatincludes a base portion and a core structure extending from the baseportion; an interposer; wherein the base portion of the supportstructure is mounted to a surface of the interposed on a first side ofthe interposer; at least one coil on the core structure; a pair ofconductive leads extending from the at least one coil to a pair ofrespective conductive pads formed on the surface of the interposer; anda flexible printed circuit coupled to a second side of the interposer,the second side opposite the first side.
 10. The near-fieldcommunications module of claim 9, wherein the interposer comprises aledge that extends outward from the base portion of the supportstructure, and wherein the pair of conductive pads are formed on theledge.
 11. The near-field communications module of claim 9, wherein thecore structure comprises a first core structure, wherein the supportstructure comprises a second core structure extending from the baseportion parallel to the first core structure, and wherein the at leastone coil comprises a first coil on the first core structure and a secondcoil on the second core structure.
 12. The near-field communicationsmodule of claim 11, wherein the first coil and the second coil areformed by first and second sets of windings of a single wire thatextends between the pair of conductive leads.
 13. The near-fieldcommunications module of claim 9, further comprising a layer of magneticmaterial disposed on the surface of the interposer between the surfaceand the base portion of the support structure.
 14. The near-fieldcommunications module of claim 13, further comprising a cowlingadhesively attached to the flexible printed circuit.
 15. The near-fieldcommunications module of claim 14, wherein the cowling comprises anopening by which the near-field communications module is configured tobe attached to an interior surface of a housing of a wearable electronicdevice.
 16. A bumper structure for a band of a wearable electronicdevice, the bumper structure comprising: a compressible material havinga first outer surface and a second outer surface opposite the firstouter surface; and a near-field communications module molded within thecompressible material adjacent the first outer surface to form an activebumper for the band, wherein a portion of the compressible materialadjacent the second outer surface forms a passive bumper for the band.17. The bumper structure of claim 16, wherein the near-fieldcommunications module comprises a band module housing that is disposedwithin the compressible material such that a layer of the compressiblematerial that is formed on the band module housing forms the first outersurface of the bumper structure.
 18. The bumper structure of claim 17,wherein the near-field communications module comprises an antennaassembly disposed within a recess in the band module housing.
 19. Thebumper structure of claim 18, wherein the near-field communicationsmodule further comprises an adhesive material that fills a space withinthe recess between the antenna assembly and the band module housing. 20.The bumper structure of claim 19, wherein the antenna assembly comprisesa substrate, a pair of coils mounted on a first side of the substrate,and near-field communications circuitry mounted on an opposing secondside of the substrate.